Method and apparatus for a backsided and recessed optical package connection
文献类型：专利
| 作者 | EPITAUX, MARC; KIRKPATRICK, PETER E.; VERDIELL, JEAN-MARC |
| 发表日期 | 2005-06-09 |
| 专利号 | US20050123251A1 |
| 著作权人 | INTEL CORPORATION |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Method and apparatus for a backsided and recessed optical package connection |
| 英文摘要 | A method and apparatus for a backsided and recessed optical package connection is described. The method includes the formation of a substrate having a top surface layer and an opposed layer, including one or more recessed portions. Following formation of the substrate, leads of a lead unit are coupled to one or more of the recessed portions of the substrate. Next, one or more optical electronic components are mounted onto the top surface of the substrate. Once the optoelectric components are mounted to the top surface of the substrate, a cap is attached to the top surface of the substrate to encapsulate the one or more optical electronic components and form an optoelectronic package. |
| 公开日期 | 2005-06-09 |
| 申请日期 | 2005-01-11 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/53530]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | INTEL CORPORATION |
| 推荐引用方式 GB/T 7714 | EPITAUX, MARC,KIRKPATRICK, PETER E.,VERDIELL, JEAN-MARC. Method and apparatus for a backsided and recessed optical package connection. US20050123251A1. 2005-06-09. |
入库方式： OAI收割
来源：西安光学精密机械研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。