Semiconductor device, manufacturing method of semiconductor device and module for optical device
文献类型：专利
| 作者 | TSUKAMOTO, HIROAKI; FUJITA, KAZUYA; YASUDOME, TAKASHI |
| 发表日期 | 2005-11-10 |
| 专利号 | US20050247992A1 |
| 著作权人 | SHARP KABUSHIKI KAISHA |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Semiconductor device, manufacturing method of semiconductor device and module for optical device |
| 英文摘要 | A bond portion for bonding the principal plane of a solid-state imaging element with a transparent covering portion and configuring a hollow portion therebetween is provided with: a first opening end portion on the hollow portion side; a second opening end portion on the outer side; and a trap portion. The first opening end portion, the trap portion and the second opening end portion constitute a vent path. The vent path is shaped not to connect the first opening end portion with the second opening end portion linearly but to connect the opening end portions in the bond portion via the trap portion larger than the opening end portions. |
| 公开日期 | 2005-11-10 |
| 申请日期 | 2005-05-09 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/53643]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SHARP KABUSHIKI KAISHA |
| 推荐引用方式 GB/T 7714 | TSUKAMOTO, HIROAKI,FUJITA, KAZUYA,YASUDOME, TAKASHI. Semiconductor device, manufacturing method of semiconductor device and module for optical device. US20050247992A1. 2005-11-10. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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