Chip-scale methods for packaging light emitting devices and chip-scale packaged light emitting devices
文献类型：专利
| 作者 | IBBETSON, JAMES; KELLER, BERND; PARIKH, PRIMIT |
| 发表日期 | 2006-01-12 |
| 专利号 | WO2006005062A2 |
| 著作权人 | CREE, INC. |
| 国家 | 世界知识产权组织 |
| 文献子类 | 发明申请 |
| 其他题名 | Chip-scale methods for packaging light emitting devices and chip-scale packaged light emitting devices |
| 英文摘要 | A packaged light emitting device includes a carrier substrate (20) having a top surface and a bottom surface, first and second conductive vias (22S, B) extending from the top surface of the substrate (20) to the bottom surface of the substrate, and a bond pad (24) on the top surface of the substrate in electrical contact with the first conductive via (22A). A diode (16) having first and second electrodes is mounted on the bond pad with the first electrode (26) is in electrical contact with the bond pad (24). A passivation layer (32) is formed on the diode (16), exposing the second electrode of the diode (16). A conductive trace (33) is formed on the top surface of the carrier substrate in electrical contact with the second conductive via (22B) and the second electrode. The conductive trace is on and extends across the passivation layer to contact the second electrode. Methods of packaging light emitting devices include providing an epiwafer including a growth substrate and an epitaxial structure on the growth substrate, bonding a carrier substrate to the epitaxial structure of the epiwafer, forming a plurality of conductive vias through the carrier substrate, defining a plurality of isolated diodes in the epitaxial structure, and electrically connecting at least one conductive via to respective ones of the plurality of isolated diodes. |
| 公开日期 | 2006-01-12 |
| 申请日期 | 2005-06-30 |
| 状态 | 未确认 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/53685]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | CREE, INC. |
| 推荐引用方式 GB/T 7714 | IBBETSON, JAMES,KELLER, BERND,PARIKH, PRIMIT. Chip-scale methods for packaging light emitting devices and chip-scale packaged light emitting devices. WO2006005062A2. 2006-01-12. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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