Light-emitting-diode packaging structure having thermal-electric element
文献类型：专利
| 作者 | YU, CHIH-KUANG; LIU, CHUN-KAI; TAIN, RA-MIN; CHENG, JEN-HAU |
| 发表日期 | 2007-01-18 |
| 专利号 | US20070012938A1 |
| 著作权人 | INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Light-emitting-diode packaging structure having thermal-electric element |
| 英文摘要 | A light-emitting-diode packaging structure having thermoelectric device, which is applied to the LED unit packaged using the flip chip technology. This is realized by directly building the thermoelectric elements into the solder bump layer of the light-emitting-diode packaging structure to replace a part of the solder bumps, as such raising the heat dissipation efficiency of the light emitting diode unit, enhancing the stability and reliability of light emission of the LED unit, and reducing the difficulties and complexity of the integration of the LED package. |
| 公开日期 | 2007-01-18 |
| 申请日期 | 2005-10-24 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/53738]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
| 推荐引用方式 GB/T 7714 | YU, CHIH-KUANG,LIU, CHUN-KAI,TAIN, RA-MIN,et al. Light-emitting-diode packaging structure having thermal-electric element. US20070012938A1. 2007-01-18. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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