Heat dissipating structure and light emitting device having the same
文献类型：专利
| 作者 | CHAE, SU-HEE; JANG, TAE-HOON; KIM, HYUNG-KUN; SUNG, YOUN-JOON |
| 发表日期 | 2006-11-09 |
| 专利号 | US20060249745A1 |
| 著作权人 | SAMSUNG ELECTRONICS CO., LTD. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Heat dissipating structure and light emitting device having the same |
| 英文摘要 | A heat dissipating structure is flip-chip bonded to a light-emitting element and facilitates heat dissipation. The heat dissipating structure includes: a submount facing the light-emitting element and having at least one groove; a conductive material layer filled into at least a portion of the at least one groove; and a solder layer interposed between the light-emitting element and the submount for bonding. The heat dissipating structure and the light-emitting device having the same allow efficient dissipation of heat generated in the light-emitting element during operation. |
| 公开日期 | 2006-11-09 |
| 申请日期 | 2006-03-24 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/53786]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SAMSUNG ELECTRONICS CO., LTD. |
| 推荐引用方式 GB/T 7714 | CHAE, SU-HEE,JANG, TAE-HOON,KIM, HYUNG-KUN,et al. Heat dissipating structure and light emitting device having the same. US20060249745A1. 2006-11-09. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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