Semiconductor laser device and heat sink used therein
文献类型：专利
| 作者 | KAWANISHI, HIDEKAZU; SASAKI, KENJI; HAMAGUCHI, YUICHI |
| 发表日期 | 2006-10-12 |
| 专利号 | US20060227827A1 |
| 著作权人 | SONY CORPORATION |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Semiconductor laser device and heat sink used therein |
| 英文摘要 | A semiconductor laser device has a heat sink of which laminated plural plates are constituted and a semiconductor laser element mounted on upper surface of the heat sink. The heat sink has a channel in which a coolant flows inside thereof. The heat sink includes a channel-forming plate portion that forms the channel and a mounting plate portion that forms an upper surface of the heat sink that comes into contact with the channel. The mounting plate portion is made of material having a thermal expansion coefficient, which is nearer that of the semiconductor laser element than that of the channel-forming plate portion. |
| 公开日期 | 2006-10-12 |
| 申请日期 | 2006-04-11 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/53793]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SONY CORPORATION |
| 推荐引用方式 GB/T 7714 | KAWANISHI, HIDEKAZU,SASAKI, KENJI,HAMAGUCHI, YUICHI. Semiconductor laser device and heat sink used therein. US20060227827A1. 2006-10-12. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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