Light emitting device package and method for manufacturing the same
文献类型：专利
| 作者 | KIM, GEUN HO; LEE, SEUNG YEOB, 402, JEONGSEOK GREEN VILLA |
| 发表日期 | 2006-11-22 |
| 专利号 | EP1724848A2 |
| 著作权人 | LG INNOTEK CO., LTD. |
| 国家 | 欧洲专利局 |
| 文献子类 | 发明申请 |
| 其他题名 | Light emitting device package and method for manufacturing the same |
| 英文摘要 | The present invention relates to a light emitting device package and a method for manufacturing the same. The present invention has advantages in that a light emitting device is electrically connected to other devices without use of wire bonding, thereby saving a space for wire bonding and reducing the size of a package. The present invention has advantages in that there is no wire in a light emitting device by using a conductive interconnection portion so that a phosphor can be easily and uniformly applied, and an area where vertically emitted light is absorbed can be reduced so that light extraction of a device can be enhanced. |
| 公开日期 | 2006-11-22 |
| 申请日期 | 2006-05-15 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/53802]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | LG INNOTEK CO., LTD. |
| 推荐引用方式 GB/T 7714 | KIM, GEUN HO,LEE, SEUNG YEOB, 402, JEONGSEOK GREEN VILLA. Light emitting device package and method for manufacturing the same. EP1724848A2. 2006-11-22. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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