Optical transceiver using optical sub-assembly having multiple lead pins connected to the substrate by a flexible printed circuit
文献类型：专利
| 作者 | SONE, HIDEMI |
| 发表日期 | 2006-11-23 |
| 专利号 | US20060263013A1 |
| 著作权人 | SUMITOMO ELECTRIC INDUSTRIES, LTD. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Optical transceiver using optical sub-assembly having multiple lead pins connected to the substrate by a flexible printed circuit |
| 英文摘要 | The present invention provides a coupling mechanism between the optical subassembly and the circuit board using the FPC board. The mechanism according to the present invention may release the mechanical stress induced in the root portion of the lead pin of the optical subassembly and shows a superior productivity. The optical assembly provides a plurality of lead pins arranged in at least two rows. The FPC board bent in the U-shape is put between rows and soldered to the lead pins in the pads thereof. One piece of the FPC board is extended to the circuit board and soldered thereto. |
| 公开日期 | 2006-11-23 |
| 申请日期 | 2006-05-19 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/53804]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SUMITOMO ELECTRIC INDUSTRIES, LTD. |
| 推荐引用方式 GB/T 7714 | SONE, HIDEMI. Optical transceiver using optical sub-assembly having multiple lead pins connected to the substrate by a flexible printed circuit. US20060263013A1. 2006-11-23. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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