High power LED package and fabrication method thereof
文献类型：专利
| 作者 | LEE, SEON GOO; HAHM, HUN JOO; PARK, JUNG KYU; HAN, KYUNG TAEG; HAN, SEONG YEON; KIM, DAE YEON; PARK, YOUNG SAM |
| 发表日期 | 2006-12-07 |
| 专利号 | US20060273338A1 |
| 著作权人 | SAMSUNG ELECTRONICS CO., LTD. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | High power LED package and fabrication method thereof |
| 英文摘要 | An LED diode package includes a heat connecting part for mounting a light emitting part on an upper surface thereof, frames electrically connected to the light emitting part while holding the heat connecting part and a molded part fixing the heat connecting part and the frames together. The light emitting part generates light in response to current applied thereto, and the upper surface of the heat connecting part is protruded beyond an upper surface of the molded part to a predetermined height. This can optimize the unique beam angle of the light source thereby to maximize lighting efficiency as well as prevent overflow of the encapsulating material in the assembling process of the lens, which may otherwise soil adjacent components. |
| 公开日期 | 2006-12-07 |
| 申请日期 | 2006-06-02 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/53808]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SAMSUNG ELECTRONICS CO., LTD. |
| 推荐引用方式 GB/T 7714 | LEE, SEON GOO,HAHM, HUN JOO,PARK, JUNG KYU,et al. High power LED package and fabrication method thereof. US20060273338A1. 2006-12-07. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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