Packaging base for semiconductor elements
文献类型：专利
| 作者 | YEN, HSIEN-CHENG; LEE, HUNG-SHENG; WU, MING-CHO; OU, SZUTSUN-SIMON |
| 发表日期 | 2006-12-21 |
| 专利号 | US20060284305A1 |
| 著作权人 | ARIMA LASERS CORP. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Packaging base for semiconductor elements |
| 英文摘要 | A packaging base for semiconductor elements is made of metal powder selected from the group consisting of cupper (Cu), iron (Fe), wolfram (W), molybdenum (Mo), aluminum (Al), indium (In), and gallium (Ga) or from an alloy of combinations thereof. A heat sink is integrally formed by metallurgical injection molding process. A fixing mount and a protection mount are positioned on the heat sink, thereby creating a packaging base structure. The protection mount surrounds the fixing mount for protecting semiconductor elements like laser diode dies. The packaging base structure includes a mounting gap for the purpose of an easy installation of the semiconductor elements. In this way, the reduction of the heat-removal capacity caused by the thermal contact resistance of the conventional configuration can be avoided so that the cooling effect can be enhanced. Meanwhile, the fabrication process is simplified. |
| 公开日期 | 2006-12-21 |
| 申请日期 | 2006-06-12 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/53812]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | ARIMA LASERS CORP. |
| 推荐引用方式 GB/T 7714 | YEN, HSIEN-CHENG,LEE, HUNG-SHENG,WU, MING-CHO,et al. Packaging base for semiconductor elements. US20060284305A1. 2006-12-21. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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