Diode-pumped, solid-state laser with chip-shaped laser medium and heat sink
文献类型：专利
| 作者 | SUN, YUNLONG; BAIRD, BRIAN |
| 发表日期 | 2007-02-22 |
| 专利号 | WO2007002019A3 |
| 著作权人 | ELECTRO SCIENTIFIC INDUSTRIES, INC. |
| 国家 | 世界知识产权组织 |
| 文献子类 | 发明申请 |
| 其他题名 | Diode-pumped, solid-state laser with chip-shaped laser medium and heat sink |
| 英文摘要 | A chip-shaped laser medium (12) is side pumped to improve mode matching between the pumping energy (50) and lasing mode volume (36). The chip thickness (44) and laser medium doping level can be designed and controlled to ensure adequate pumping coupling efficiency. The chip shape can also be employed to provide greater chip surface areas (22) for cooling the laser medium (12). The laser pumping package (70), gain module (101), and chip-shaped design can be scalable to offer higher pumping power and high output power. Different orientations of the gain modules (101) with respect to each other can be used to provide better lasing mode quality. |
| 公开日期 | 2007-02-22 |
| 申请日期 | 2006-06-19 |
| 状态 | 未确认 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/53813]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | ELECTRO SCIENTIFIC INDUSTRIES, INC. |
| 推荐引用方式 GB/T 7714 | SUN, YUNLONG,BAIRD, BRIAN. Diode-pumped, solid-state laser with chip-shaped laser medium and heat sink. WO2007002019A3. 2007-02-22. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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