Laser device including heat sink with a tailored coefficient of thermal expansion
文献类型：专利
| 作者 | MILLER, ROBERT L.; SRINIVASAN, RAMAN |
| 发表日期 | 2008-01-10 |
| 专利号 | US20080008217A1 |
| 著作权人 | NEWPORT CORPORATION |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Laser device including heat sink with a tailored coefficient of thermal expansion |
| 英文摘要 | A laser module comprising a laser device attached to a heat sink that is configured to provide a relatively low thermal resistance for thermal management of the laser device, and a coefficient of thermal expansion (CTE) that is substantially matched to the CTE of the laser device for reducing stress caused by thermal cycles and bonding. In one embodiment, the heat sink comprises a substrate made out of a first material, and including one or more via holes filled with a second material distinct from the first material of the substrate. By properly selecting the first and second materials, configuring the overall mass of the substrate with respect to the overall mass of the filled via holes, and positioning and arranging the filled via holes with respect to the laser device, the desired effective thermal resistance and CTE for the heat sink may be achieved. In another embodiment, the laser module comprises a laser device attached to a submount, which is, in turn, attached to a heat sink. In this embodiment, the submount is configured as the heat sink discussed above. |
| 公开日期 | 2008-01-10 |
| 申请日期 | 2006-07-07 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/53823]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | NEWPORT CORPORATION |
| 推荐引用方式 GB/T 7714 | MILLER, ROBERT L.,SRINIVASAN, RAMAN. Laser device including heat sink with a tailored coefficient of thermal expansion. US20080008217A1. 2008-01-10. |
入库方式： OAI收割
来源：西安光学精密机械研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。