Underfill for light emitting device
文献类型：专利
| 作者 | GAO, XIANG; SACKRISON, MICHAEL; VENUGOPALAN, HARI S. |
| 发表日期 | 2008-03-13 |
| 专利号 | US20080061312A1 |
| 著作权人 | CURRENT LIGHTING SOLUTIONS, LLC |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Underfill for light emitting device |
| 英文摘要 | A light emitting chip is disposed on a support surface. A plurality of bonding bumps are disposed in a gap between the light emitting chip and the support surface. The plurality of bonding bumps provide at least one electrical power input path to the light emitting chip. An underfill comprising underfill material is disposed in the gap between the light emitting chip and the support surface such that the underfill substantially fills the gap but does not form a fillet extending outside the gap over sidewalls of the light emitting chip. The underfill is configured to provide at least one of (i) mechanical support for the light emitting chip and (ii) a thermal conduction path from the light emitting chip to the support surface. |
| 公开日期 | 2008-03-13 |
| 申请日期 | 2006-09-12 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/53840]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | CURRENT LIGHTING SOLUTIONS, LLC |
| 推荐引用方式 GB/T 7714 | GAO, XIANG,SACKRISON, MICHAEL,VENUGOPALAN, HARI S.. Underfill for light emitting device. US20080061312A1. 2008-03-13. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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