Solder layer, heat sink using such solder layer and method for manufacturing such heat sink
文献类型：专利
| 作者 | NAKANO, MASAYUKI C/O DOWA ELECTRONICS MATERIALS CO., LTD.; OSHIKA, YOSHIKAZU C/O DOWA ELECTRONICS MATERIALS CO., LTD. |
| 发表日期 | 2008-07-02 |
| 专利号 | EP1939929A1 |
| 著作权人 | DOWA ELECTRONICS MATERIALS CO., LTD. |
| 国家 | 欧洲专利局 |
| 文献子类 | 发明申请 |
| 其他题名 | Solder layer, heat sink using such solder layer and method for manufacturing such heat sink |
| 英文摘要 | A heat sink (10) is disclosed which comprises a substrate (1), an electrode layer (2) formed on the substrate (1) and a solder layer (3) formed on the substrate (1) wherein the solder layer (3) provides a bonding strength of not less than 30 MPa and a shear strain of not less than 0.07. The hear sink may be a sub-mount which comprises a sub-mount substrate (1), an electrode layer (2) formed on the substrate (1) and a solder layer (3) formed on the substrate (1) wherein the electrode layer (2) is formed with a window portion (2A) having the solder layer (3) embedded therein and is connected to an outer peripheral area of the solder layer (3). A sub-mount that has a high strength of bonding between the solder layer (3) and a semiconductor device is provided at a reduced cost. |
| 公开日期 | 2008-07-02 |
| 申请日期 | 2006-09-19 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/53846]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | DOWA ELECTRONICS MATERIALS CO., LTD. |
| 推荐引用方式 GB/T 7714 | NAKANO, MASAYUKI C/O DOWA ELECTRONICS MATERIALS CO., LTD.,OSHIKA, YOSHIKAZU C/O DOWA ELECTRONICS MATERIALS CO., LTD.. Solder layer, heat sink using such solder layer and method for manufacturing such heat sink. EP1939929A1. 2008-07-02. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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