Modular laser package system
文献类型：专利
| 作者 | MURRY, STEFAN J.; MORBI, ZULFIKAR |
| 发表日期 | 2007-08-16 |
| 专利号 | US20070189677A1 |
| 著作权人 | APPLIED OPTOELECTRONICS, INC. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Modular laser package system |
| 英文摘要 | A modular laser package system may be used to mount one type of laser package, such as a coaxial or TO (transistor outline) can laser package, to a circuit board, such as a transmitter board or a motherboard, designed to receive another type of laser package housing, such as a butterfly-type laser package housing. The modular laser package system may include a circuit board mounting platform, a laser housing mount to mount the laser package to the circuit board mounting platform, and a mounting base to facilitate mounting to the transmitter board or motherboard. The modular laser package system may also include a temperature control device, such as a thermoelectric cooler (TEC), and a temperature sensor, such as a thermistor, mounted to the laser housing mount to control and monitor the temperature of the laser package. |
| 公开日期 | 2007-08-16 |
| 申请日期 | 2007-02-06 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/53904]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | APPLIED OPTOELECTRONICS, INC. |
| 推荐引用方式 GB/T 7714 | MURRY, STEFAN J.,MORBI, ZULFIKAR. Modular laser package system. US20070189677A1. 2007-08-16. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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