Thermosetting composition for optical semiconductor, die bond material for optical semiconductor device, underfill material for optical semiconductor device, sealing agent for optical semiconductor device, and optical semiconductor device
文献类型：专利
| 作者 | TANIKAWA, MITSURU; WATANABE, TAKASHI; NISHIMURA, TAKASHI |
| 发表日期 | 2009-01-21 |
| 专利号 | EP2017295A1 |
| 著作权人 | SEKISUI CHEMICAL CO., LTD. |
| 国家 | 欧洲专利局 |
| 文献子类 | 发明申请 |
| 其他题名 | Thermosetting composition for optical semiconductor, die bond material for optical semiconductor device, underfill material for optical semiconductor device, sealing agent for optical semiconductor device, and optical semiconductor device |
| 英文摘要 | To provide a thermosetting composition for an optical semiconductor which is highly transparent, is free-from decrease in thickness or discoloration of a cured product due to heat generation or light emitting of a light emitting device, is superior in heat resistance and lightfastness, and has excellent adhesion to a housing material or the like, a sealing agent for an optical semiconductor device and a die bond material for an optical semiconductor device using the same, and an optical semiconductor device obtained by using the thermosetting composition for an optical semiconductor, the sealing agent for an optical semiconductor, the die bond material for an optical semiconductor device and/or the underfill material for an optical semiconductor device. A thermosetting composition for an optical semiconductor containing a silicone resin having a cyclic ether-containing groups and a thermosetting agent capable of reacting with said cyclic ether-containing group, wherein the silicone resin has, as the principal components, a structural unit expressed by the following formula (1) and a structural unit expressed by the following formula (2), the content of the structural unit expressed by the formula (1) is 0.6 to 0.95 (on a molar basis) and the content of the structural unit expressed by the formula (2) is 0.05 to 0.4 (on a molar basis) when total number of the structural units contained is taken as 1, and the content of the cyclic ether-containing group is 5 to 40 mol%: [formula 1] (R1R2SiO2/2) (1) and [formula 2] (R3SiO3/2) (2) in the formula (1) and (2), at least one of R1, R2 and R3 represents a cyclic ether-containing group, R1, R2 and R3 other than the cyclic ether-containing group represent hydrocarbon having 1 to 8 carbon atoms or fluoride thereof and they may be the same or may be different from one another and plural types of R1, R2 and R3 different from each other in a repeating unit in a silicone resin skeleton may be contained. |
| 公开日期 | 2009-01-21 |
| 申请日期 | 2007-04-25 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/53925]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SEKISUI CHEMICAL CO., LTD. |
| 推荐引用方式 GB/T 7714 | TANIKAWA, MITSURU,WATANABE, TAKASHI,NISHIMURA, TAKASHI. Thermosetting composition for optical semiconductor, die bond material for optical semiconductor device, underfill material for optical semiconductor device, sealing agent for optical semiconductor device, and optical semiconductor device. EP2017295A1. 2009-01-21. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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