Encapsulating and transferring low dimensional structures
文献类型：专利
| 作者 | DAY, STEPHEN; ALTEBAEUMER, THOMAS HEINZ-HELMUT; HEFFERNAN, JONATHAN |
| 发表日期 | 2010-01-21 |
| 专利号 | US20100012180A1 |
| 著作权人 | SHARP KABUSHIKI KAISHA |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Encapsulating and transferring low dimensional structures |
| 英文摘要 | A method of encapsulating low dimensional structures comprises forming a first group (3a) of low dimensional structures (1) and a second group (3b) of low dimensional structures (1) on a first substrate. The first group (3a) of low dimensional structures (1) and the second group (3b) of low dimensional structures (1) are encapsulated in a matrix (5), with the first group (3a) of low dimensional structures (1) being encapsulated separately from the second group (3b) of low dimensional structures (1). After encapsulation, the first group (3a) of low dimensional structures (1) may be separated from the second group (3b) of low dimensional structures (1). Each group may then be processed, for example by transfer to a second substrate (7). The number of low dimensional structures in a group, and the aspect ratio of a group is defined when the low dimensional structures are formed, and can therefore be controlled more accurately than in a conventional method in which groups are defined using a patterning technique. |
| 公开日期 | 2010-01-21 |
| 申请日期 | 2007-10-11 |
| 状态 | 申请中 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/53969]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SHARP KABUSHIKI KAISHA |
| 推荐引用方式 GB/T 7714 | DAY, STEPHEN,ALTEBAEUMER, THOMAS HEINZ-HELMUT,HEFFERNAN, JONATHAN. Encapsulating and transferring low dimensional structures. US20100012180A1. 2010-01-21. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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