Structure for mounting semiconductor package
文献类型：专利
| 作者 | SASAKI, JUNICHI; HINO, TOMOYUKI |
| 发表日期 | 2010-12-09 |
| 专利号 | US20100309635A1 |
| 著作权人 | NEC CORPORATION |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Structure for mounting semiconductor package |
| 英文摘要 | A mounting structure, in which semiconductor package 1 and heat sink 8 for dissipating heat generated from semiconductor package 1 are mounted on mounting board 3. The rear surface of semiconductor package 1 is bonded to the front surface of mounting board 3 facing the rear surface. Heat sink 8 is brought into contact with the rear surface of semiconductor package 1 via through-ole 5 formed on mounting board 3. Semiconductor package 1 and heat sink 8 are pressed to each other by the elastic force of clip 6. |
| 公开日期 | 2010-12-09 |
| 申请日期 | 2007-11-30 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/53976]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | NEC CORPORATION |
| 推荐引用方式 GB/T 7714 | SASAKI, JUNICHI,HINO, TOMOYUKI. Structure for mounting semiconductor package. US20100309635A1. 2010-12-09. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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