Integrating optoelectronic components into a molded communications module having integrated plastic circuit structures
文献类型：专利
| 作者 | NELSON, STEPHEN T.; ICE, DONALD A.; DOUMA, DARIN JAMES |
| 发表日期 | 2008-06-19 |
| 专利号 | US20080145060A1 |
| 著作权人 | FINISAR CORPORATION |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Integrating optoelectronic components into a molded communications module having integrated plastic circuit structures |
| 英文摘要 | Integrated optical subassemblies (OSA) such as integrated transmit and receive optical subassemblies that may be implemented with an optical transceiver module that includes a molded body. The integrated OSA includes a mounting surface defined on a vertical portion of the molded body, a wall extending about the mounting surface, at least one optoelectronic device, such as a laser diode or a photodiode mounted on a transimpendence amplifier, positioned on the mounting surface, a plurality of bond pads included on the mounting surface in electrical connection with the at least one optoelectronic device, a plurality of conductive feedthroughs defined through the mounting surface, each feedthrough being in electrical communication with a corresponding one of the bond pads; and an optical fiber port that engages the wall extending about the mounting surface, wherein the optical fiber port is configured for receiving an optical fiber cable. |
| 公开日期 | 2008-06-19 |
| 申请日期 | 2007-12-17 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/53982]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | FINISAR CORPORATION |
| 推荐引用方式 GB/T 7714 | NELSON, STEPHEN T.,ICE, DONALD A.,DOUMA, DARIN JAMES. Integrating optoelectronic components into a molded communications module having integrated plastic circuit structures. US20080145060A1. 2008-06-19. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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