中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Silicone resin composition for encapsulating luminescent element and process for producing optical-semiconductor electronic part with the same through potting

文献类型:专利

作者MIYAWAKI, YOSHITERU; TANAKA, OSAMU
发表日期2009-12-02
专利号EP2128201A1
著作权人SANYU REC CO., LTD.
国家欧洲专利局
文献子类发明申请
其他题名Silicone resin composition for encapsulating luminescent element and process for producing optical-semiconductor electronic part with the same through potting
英文摘要The present invention provides a silicone resin composition for encapsulating light-emitting elements with which encapsulation using a potting method can be easily accomplished, and which can be easily molded into a lens shape such as hemisphere, parabola, or the like. The composition can impart high transparency to the resulting encapsulating lens molded using a potting method. More particularly, the invention provides a silicone resin composition for encapsulating light-emitting elements, including 2 to 25 wt% of silica with a mean particle size of 1 to 30 nm based on the total amount of Components (A) and (B); and having a viscosity (23°C) of more than 10 Pa·s and less than 70 Pa·s, and a thixotropic index of 2.0 to 5.5; the composition being used for encapsulation using a potting method. The invention also provides a process for producing an optical semiconductor electronic part, including applying the composition as an encapsulating resin to a substrate with a light-emitting element, thereby molding the encapsulating resin into a lens shape by potting.
公开日期2009-12-02
申请日期2008-03-10
状态失效
源URL[http://ir.opt.ac.cn/handle/181661/54006]  
专题半导体激光器专利数据库
作者单位SANYU REC CO., LTD.
推荐引用方式
GB/T 7714
MIYAWAKI, YOSHITERU,TANAKA, OSAMU. Silicone resin composition for encapsulating luminescent element and process for producing optical-semiconductor electronic part with the same through potting. EP2128201A1. 2009-12-02.

入库方式: OAI收割

来源:西安光学精密机械研究所

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