Method for manufacturing semiconductor device, semiconductor device and optical pickup module
文献类型：专利
| 作者 | FURUYASHIKII, JUNYA; MORIBE, SYOUZOU; UTATSU, HIROKI; YOSHIKAWA, NORIYUKI; FUKUDA, TOSHIYUKI; MINAMIO, MASANORI; ISHIDA, HIROYUKI |
| 发表日期 | 2010-04-15 |
| 专利号 | US20100091633A1 |
| 著作权人 | PANASONIC CORPORATION |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Method for manufacturing semiconductor device, semiconductor device and optical pickup module |
| 英文摘要 | A flat pre-board plate including connection electrodes, internal interconnections, and external-connection portions is prepared. This pre-board plate is cut at portions each located between adjacent ones of the connection electrodes, thereby forming trenches. A plurality of semiconductor elements are placed in each of the trenches. Electrode pads and the connection electrodes are connected to each other by metal wires. Transparent lids are placed on, and bonded to, spacers to cover the semiconductor elements. Thereafter, two lines of the connection electrodes arranged between adjacent ones of the trenches are separated from each other. Subsequently, adjacent ones of the semiconductor elements are also separated from each other. |
| 公开日期 | 2010-04-15 |
| 申请日期 | 2008-03-10 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54007]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | PANASONIC CORPORATION |
| 推荐引用方式 GB/T 7714 | FURUYASHIKII, JUNYA,MORIBE, SYOUZOU,UTATSU, HIROKI,et al. Method for manufacturing semiconductor device, semiconductor device and optical pickup module. US20100091633A1. 2010-04-15. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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