Temperature measurement and control of wafer support in thermal processing chamber
文献类型：专利
| 作者 | SORABJI, KHURSHED; LERNER, ALEXANDER N.; RANISH, JOSEPH M.; HUNTER, AARON M.; ADAMS, BRUCE; BEHDJAT, MEHRAN; RAMANUJAM, RAJESH S. |
| 发表日期 | 2008-07-17 |
| 专利号 | US20080169282A1 |
| 著作权人 | APPLIED MATERIALS, INC. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Temperature measurement and control of wafer support in thermal processing chamber |
| 英文摘要 | Apparatus and methods for achieving uniform heating or cooling of a substrate during a rapid thermal process are disclosed. More particularly, apparatus and methods for controlling the temperature of an edge ring supporting a substrate and/or a reflector plate during a rapid thermal process to improve temperature uniformity across the substrate are disclosed, which include a thermal mass or plate adjacent the edge ring to heat or cool the edge ring. |
| 公开日期 | 2008-07-17 |
| 申请日期 | 2008-03-25 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54013]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | APPLIED MATERIALS, INC. |
| 推荐引用方式 GB/T 7714 | SORABJI, KHURSHED,LERNER, ALEXANDER N.,RANISH, JOSEPH M.,et al. Temperature measurement and control of wafer support in thermal processing chamber. US20080169282A1. 2008-07-17. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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