Light emitting apparatus and method for manufacturing same
文献类型：专利
| 作者 | HOSOKAWA, TADAAKI; HORIUCHI, OSAMU; MATSUYAMA, TAKAYUKI; OKADA, MAKOTO |
| 发表日期 | 2008-10-09 |
| 专利号 | US20080246051A1 |
| 著作权人 | KABUSHIKI KAISHA TOSHIBA |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Light emitting apparatus and method for manufacturing same |
| 英文摘要 | A light emitting apparatus includes: a light emitting element including a laminated body, an electrode provided on the laminated body, and a pad electrode provided on the electrode, the laminated body including a semiconductor light emitting layer; a mounting member having a metal bonding layer; and an alloy solder containing gold for bonding the pad electrode to the metal bonding layer. The pad electrode has at least a first gold layer provided on the electrode and being thicker than the electrode and a first metal barrier layer provided on the first gold layer, and the melting point of the alloy solder is lower than the melting point of alloys with elements constituting the first metal barrier layer and the alloy solder. |
| 公开日期 | 2008-10-09 |
| 申请日期 | 2008-04-04 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54015]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | KABUSHIKI KAISHA TOSHIBA |
| 推荐引用方式 GB/T 7714 | HOSOKAWA, TADAAKI,HORIUCHI, OSAMU,MATSUYAMA, TAKAYUKI,et al. Light emitting apparatus and method for manufacturing same. US20080246051A1. 2008-10-09. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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