Epoxy resin composition, cured object obtained therefrom, and light-emitting diode
文献类型：专利
| 作者 | SATO, TAKASHI; UENO, SHUICHI; KOYAMA, TAKESHI |
| 发表日期 | 2010-08-05 |
| 专利号 | US20100193831A1 |
| 著作权人 | MITSUBISHI GAS CHEMICAL COMPANY, INC. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Epoxy resin composition, cured object obtained therefrom, and light-emitting diode |
| 英文摘要 | Provided are an epoxy resin composition including acid anhydrides (A) and epoxy resins (B), in which: (a) cyclohexane-1,2,4-tricarboxylic acid-1,2-anhydride accounts for 50 to 90 mass % of the acid anhydrides (A); (b) an alicyclic epoxy resin compound accounts for 30 to 90 mass % of the epoxy resins (B) and an epoxy resin compound represented by the following general formula (1) accounts for 10 to 50 mass % of the epoxy resins (B); and (c) contents of the acid anhydrides (A) and the epoxy resins (B) are such that a blending equivalent ratio between the acid anhydrides and the epoxy resins ranges from 0.4 to 0.7, a cured product of the composition, and a light-emitting diode. The epoxy resin composition has the following characteristics. That is, (1) the composition has a low viscosity after the mixing, a low degree of viscosity increase in standing at room temperature, and excellent workability, (2) the composition has satisfactory curability even when no curing accelerator is added, and (3) a cured product is colorless and transparent, has crack resistance, and changes its color to a small extent with long-term light irradiation and heating. The composition is suitable for an encapsulant for a photoelectric conversion element such as a blue LED or white LED. (In the formula, R's each independently represent a hydrogen atom or a methyl group, m represents an integer of 1 to 3, and n represents an integer of 2 to 8.) |
| 公开日期 | 2010-08-05 |
| 申请日期 | 2008-09-22 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54040]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | MITSUBISHI GAS CHEMICAL COMPANY, INC. |
| 推荐引用方式 GB/T 7714 | SATO, TAKASHI,UENO, SHUICHI,KOYAMA, TAKESHI. Epoxy resin composition, cured object obtained therefrom, and light-emitting diode. US20100193831A1. 2010-08-05. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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