Junction Structure Between Optical Element and Substrate, Optical Transmission/Receiving Module, and Method of Manufacturing the Optical Module
文献类型:专利
作者 | TAKAI, TOSHIAKI; MIZUSHIMA, AKIKO; MATSUSHIMA, NAOKI |
发表日期 | 2009-07-16 |
专利号 | US20090180732A1 |
著作权人 | HITACHI CABLE, LTD. |
国家 | 美国 |
文献子类 | 发明申请 |
其他题名 | Junction Structure Between Optical Element and Substrate, Optical Transmission/Receiving Module, and Method of Manufacturing the Optical Module |
英文摘要 | The present invention provides a junction structure between an optical element and a substrate. The junction structure is formed by supplying an under-fill resin not containing a filler to a portion functioning as a light path for light emitted from or incoming into the optical element on the substrate, then jointing a conductive bump of the optical element to electric wiring on the substrate, and then thermally hardening the under-fill resin not containing a filler to bond the resin not containing a filler to the optical element and to the substrate so that the under-fill resin containing a filler will not enter a space between the optical element and the substrate when the under-fill resin containing a filler is filled in portions other than the light path between the optical element and the substrate. |
公开日期 | 2009-07-16 |
申请日期 | 2008-10-24 |
状态 | 失效 |
源URL | [http://ir.opt.ac.cn/handle/181661/54046] ![]() |
专题 | 半导体激光器专利数据库 |
作者单位 | HITACHI CABLE, LTD. |
推荐引用方式 GB/T 7714 | TAKAI, TOSHIAKI,MIZUSHIMA, AKIKO,MATSUSHIMA, NAOKI. Junction Structure Between Optical Element and Substrate, Optical Transmission/Receiving Module, and Method of Manufacturing the Optical Module. US20090180732A1. 2009-07-16. |
入库方式: OAI收割
来源:西安光学精密机械研究所
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