Cooling device for semiconductor elements, semiconductor cooling arrangement and method for producing the same
文献类型：专利
| 作者 | LORENZEN, DIRK |
| 发表日期 | 2009-04-30 |
| 专利号 | WO2009052814A2 |
| 著作权人 | LORENZEN, DIRK |
| 国家 | 世界知识产权组织 |
| 文献子类 | 发明申请 |
| 其他题名 | Cooling device for semiconductor elements, semiconductor cooling arrangement and method for producing the same |
| 英文摘要 | The invention relates to a cooling device for semiconductor elements. The aim of the invention is to increase the effectiveness of the corrosion proofing and to increase the service life of the cooling device by reducing the corrodibility of the cooling channels while safeguarding the reliability of the device in relation to the semiconductor element. The invention is characterized in that a cooling channel structure which is interspaced from the assembly surface for the semiconductor element has cooling ribs that are integrally bonded to the heat-conducting zone and that mainly contain tantalum and/or niobium in at least one core zone. |
| 公开日期 | 2009-04-30 |
| 申请日期 | 2008-10-26 |
| 状态 | 未确认 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54047]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | LORENZEN, DIRK |
| 推荐引用方式 GB/T 7714 | LORENZEN, DIRK. Cooling device for semiconductor elements, semiconductor cooling arrangement and method for producing the same. WO2009052814A2. 2009-04-30. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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