Substrate for light emitting element package, and light emitting element package
文献类型：专利
| 作者 | SUZUKI, MOTOHIRO; YONEMURA, NAOMI; MAEDA, TETSURO; YOSHIMURA, EIJI |
| 发表日期 | 2011-11-10 |
| 专利号 | US20110272731A1 |
| 著作权人 | DENKI KAGAKU KOGYO KABUSHIKI KAISHA |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Substrate for light emitting element package, and light emitting element package |
| 英文摘要 | This invention provides a substrate for a light emitting element package that can obtain a sufficient heat dissipation effect from a light emitting element and can also lower the costs and reduce the size as a substrate for packaging the light emitting element, as well as a light emitting element package using the same. The substrate for a light emitting element package includes an insulating layer 1 composed of a resin 1a containing heat conductive fillers 1b, 1c, a thick metal section 2 formed under a mounting position of a light emitting element 4, and a surface electrode section 3 formed on a mounting side of said insulating layer 1 separately from said thick metal section 2. |
| 公开日期 | 2011-11-10 |
| 申请日期 | 2008-10-31 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54050]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | DENKI KAGAKU KOGYO KABUSHIKI KAISHA |
| 推荐引用方式 GB/T 7714 | SUZUKI, MOTOHIRO,YONEMURA, NAOMI,MAEDA, TETSURO,et al. Substrate for light emitting element package, and light emitting element package. US20110272731A1. 2011-11-10. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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