Encapsulating package, printed circuit board, electronic device and method for manufacturing encapsulating package
文献类型：专利
| 作者 | YAMAZAKI, TAKAO; SANO, MASAHIKO; KURASHINA, SEIJI; SOGAWA, YOSHIMICHI |
| 发表日期 | 2011-05-19 |
| 专利号 | US20110114840A1 |
| 著作权人 | GODO KAISHA IP BRIDGE 1 |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Encapsulating package, printed circuit board, electronic device and method for manufacturing encapsulating package |
| 英文摘要 | The present invention is: a package main body section having a hollow section; and an electronic device provided in the hollow section in the package main body section, in the package main body section, there being formed a through hole, through which the hollow section communicates with outside of the package main body section, and in the through hole, there being provided a sealing section in which a vicinity of the through hole is partly heated and a constituent material of the package main body section is melted to thereby block the through hole. |
| 公开日期 | 2011-05-19 |
| 申请日期 | 2009-01-28 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54069]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | GODO KAISHA IP BRIDGE 1 |
| 推荐引用方式 GB/T 7714 | YAMAZAKI, TAKAO,SANO, MASAHIKO,KURASHINA, SEIJI,et al. Encapsulating package, printed circuit board, electronic device and method for manufacturing encapsulating package. US20110114840A1. 2011-05-19. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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