Silicone leaded chip carrier
文献类型：专利
| 作者 | TAN, KHENG LENG; NG, KEAT CHUAN; LEE, KEE HON |
| 发表日期 | 2010-11-18 |
| 专利号 | US20100289055A1 |
| 著作权人 | AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Silicone leaded chip carrier |
| 英文摘要 | In an embodiment, the invention provides a SLCC package comprising first and second electrically conductive terminals, a polysiloxane and glass fiber structural body, a light source and a polysiloxane encapsulant. The first and second electrically conductive terminals are attached to the polysiloxane and glass fiber structural body. The light source is electrically connected to the first and second electrically conductive terminals. The polysiloxane and glass fiber structural body has a cavity that contains at least a portion of the polysiloxane encapsulant. |
| 公开日期 | 2010-11-18 |
| 申请日期 | 2009-05-14 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54080]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD. |
| 推荐引用方式 GB/T 7714 | TAN, KHENG LENG,NG, KEAT CHUAN,LEE, KEE HON. Silicone leaded chip carrier. US20100289055A1. 2010-11-18. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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