Heat transfer device with at least one semiconductor element, particularly a laser or light-emitting diode element, and method for the assembly thereof
文献类型：专利
| 作者 | SCHROEDER, MATTHIAS; LORENZEN, DIRK |
| 发表日期 | 2011-06-16 |
| 专利号 | US20110142087A1 |
| 著作权人 | JENOPTIK LASER GMBH |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Heat transfer device with at least one semiconductor element, particularly a laser or light-emitting diode element, and method for the assembly thereof |
| 英文摘要 | The invention relates, among other things, to a method for the assembly of a semiconductor component, wherein the semiconductor component on mutually opposing sides is joined in a first and a second bonded connection with a heat-conducting body each. For this purpose, the heat-conducting bodies are joined in a third bonded connection in the region of the sections thereof extending away from the semiconductor element, wherein a spacer, which with regard to the third connection is disposed on the opposite side of the semiconductor component between the heat-conducting bodies, in conjunction with the requirement that the joining zone thickness of the third connection is greater than that of the first or the second joining zone, ensures that defined joining zone thicknesses in the bonded connection are maintained during the joining process. The third connection is used for the at least partial heat transfer of the waste heat of the semiconductor component, particularly to a heat sink that is connected to the heat transfer device produced according to the invention. |
| 公开日期 | 2011-06-16 |
| 申请日期 | 2009-06-02 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54086]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | JENOPTIK LASER GMBH |
| 推荐引用方式 GB/T 7714 | SCHROEDER, MATTHIAS,LORENZEN, DIRK. Heat transfer device with at least one semiconductor element, particularly a laser or light-emitting diode element, and method for the assembly thereof. US20110142087A1. 2011-06-16. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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