High power laser package with vapor chamber
文献类型：专利
| 作者 | LEE, HSING-CHUNG |
| 发表日期 | 2010-12-09 |
| 专利号 | US20100309940A1 |
| 著作权人 | LEE HSING-CHUNG |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | High power laser package with vapor chamber |
| 英文摘要 | A heat spreader structure includes a high power laser with an epi side and an emitting facet. A vapor chamber includes a housing defining an inner vapor cavity and a wick positioned in the vapor cavity to define an evaporation area on one side of the cavity, a condensation area on an opposite side of the cavity, and fluid communication between the condensation area and the evaporation area. A space defined between the evaporation area and the condensation area. The wick includes a porous powder sintered to inner surfaces of the sealed cavity to hold the porous powder in position. The epi side of the laser is coupled to the one side of the vapor chamber and heat removal mechanism is coupled to the opposite side of the cavity. |
| 公开日期 | 2010-12-09 |
| 申请日期 | 2009-06-04 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54088]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | LEE HSING-CHUNG |
| 推荐引用方式 GB/T 7714 | LEE, HSING-CHUNG. High power laser package with vapor chamber. US20100309940A1. 2010-12-09. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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