Package module structure of compound semiconductor devices and fabricating method thereof
文献类型：专利
| 作者 | TSENG, WEN LIANG; CHEN, LUNG HSIN; KUO, CHESTER |
| 发表日期 | 2010-04-22 |
| 专利号 | US20100096746A1 |
| 著作权人 | ADVANCED OPTOELECTRONIC TECHNOLOGY INC. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Package module structure of compound semiconductor devices and fabricating method thereof |
| 英文摘要 | A compound semiconductor device package module structure includes a heat dissipation film, a dielectric layer, a plurality of compound semiconductor dies, means for mounting the compound semiconductor dies on the heat dissipation film, and a transparent encapsulation material. The dielectric layer includes a plurality of openings formed on the heat dissipation film. The compound semiconductor dies are placed on the heat dissipation film in the openings, and adjacent two compound semiconductor dies are separated by the dielectric layer. The transparent encapsulation material covers the compound semiconductor dies. |
| 公开日期 | 2010-04-22 |
| 申请日期 | 2009-10-16 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54108]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | ADVANCED OPTOELECTRONIC TECHNOLOGY INC. |
| 推荐引用方式 GB/T 7714 | TSENG, WEN LIANG,CHEN, LUNG HSIN,KUO, CHESTER. Package module structure of compound semiconductor devices and fabricating method thereof. US20100096746A1. 2010-04-22. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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