Sheet for photosemiconductor encapsulation
文献类型：专利
| 作者 | HIROKAZU, MATSUDA; RYUICHI, KIMURA; KOJI, AKAZAWA; KAZUYA, FUJIOKA; HIDEYUKI, USUI; SUEHIRO, ICHIRO |
| 发表日期 | 2014-04-16 |
| 专利号 | EP2219242A3 |
| 著作权人 | NITTO DENKO CORPORATION |
| 国家 | 欧洲专利局 |
| 文献子类 | 发明申请 |
| 其他题名 | Sheet for photosemiconductor encapsulation |
| 英文摘要 | The present invention relates to a sheet for photosemiconductor encapsulation having a release sheet and an encapsulating resin layer laminated thereon, in which the release sheet contains a concave-convex portion-forming layer having a concave shape and/or a convex shape, at an interface with the encapsulating resin layer, and the encapsulating resin layer has a convex shape fitted to the concave shape of the release sheet and/or a concave shape fitted to the convex shape of the release sheet at an interface with the release sheet. |
| 公开日期 | 2014-04-16 |
| 申请日期 | 2010-02-17 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54140]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | NITTO DENKO CORPORATION |
| 推荐引用方式 GB/T 7714 | HIROKAZU, MATSUDA,RYUICHI, KIMURA,KOJI, AKAZAWA,et al. Sheet for photosemiconductor encapsulation. EP2219242A3. 2014-04-16. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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