optoelectronic transistor outline (TO)-can header assembly having a configuration that improves heat dissipation and reduces thermal resistance
文献类型：专利
| 作者 | SCOFET, MARCO; TALLONE, LUIGI; GENISIO, STEFANO |
| 发表日期 | 2011-09-15 |
| 专利号 | US20110222567A1 |
| 著作权人 | AVAGO TECHNOLOGIES FIBER IP (SINGAPORE) PTE. LTD. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | optoelectronic transistor outline (TO)-can header assembly having a configuration that improves heat dissipation and reduces thermal resistance |
| 英文摘要 | A TO-can header assembly is provided that has improved heat dissipation and thermal resistance characteristics. The TO-can header assembly includes a relatively large ceramic heat dissipation block that functions as both a carrier for the laser diode and as a heat dissipation device. The ceramic heat dissipation block is in contact with the upper mounting surface of the header to allow a relatively large amount of heat to quickly pass from the laser diode through the heat dissipation block and into the upper mounting surface of the header. The cylindrical side wall of the header is smooth, rather than notched, and at least a substantial portion of the smooth cylindrical side wall is in continuous contact with an external heat sink device. Heat moves rapidly from the header into the external heat sink device where it is dissipated, thereby reducing the thermal resistance of the header. |
| 公开日期 | 2011-09-15 |
| 申请日期 | 2010-03-09 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54146]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | AVAGO TECHNOLOGIES FIBER IP (SINGAPORE) PTE. LTD. |
| 推荐引用方式 GB/T 7714 | SCOFET, MARCO,TALLONE, LUIGI,GENISIO, STEFANO. optoelectronic transistor outline (TO)-can header assembly having a configuration that improves heat dissipation and reduces thermal resistance. US20110222567A1. 2011-09-15. |
入库方式： OAI收割
来源：西安光学精密机械研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。