Optoelectronic Component
文献类型：专利
| 作者 | MULLER, KLAUS; SPATH, GUNTER; HERRMANN, SIEGFRIED; GUNTHER, EWALD KARL MICHAEL; BRUNNER, HERBERT |
| 发表日期 | 2012-10-04 |
| 专利号 | US20120248492A1 |
| 著作权人 | OSRAM OPTO SEMICONDUCTORS GMBH |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Optoelectronic Component |
| 英文摘要 | The invention relates to an optoelectronic component, having —a carrier (1) comprising a first main surface (Ia), —at least one optoelectronic semiconductor chip (2) having no substrate, and —a contact metallization (3a, 3b), wherein —the carrier (1) is electrically insulating, —the at least one optoelectronic semiconductor chip (2) is fastened to the first main surface (Ia) of the carrier (1) by means of a bonding material (4), particularly a solder material, —the contact metallization (3a, 3b) covers at least one area of the first main surface (Ia) free of the optoelectronic semiconductor chip (2), and —the contact metallization (3a, 3b) is electrically conductively connected to the optoelectronic semiconductor chip (2). |
| 公开日期 | 2012-10-04 |
| 申请日期 | 2010-08-31 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54174]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | OSRAM OPTO SEMICONDUCTORS GMBH |
| 推荐引用方式 GB/T 7714 | MULLER, KLAUS,SPATH, GUNTER,HERRMANN, SIEGFRIED,et al. Optoelectronic Component. US20120248492A1. 2012-10-04. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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