Compliant bonding structures for semiconductor devices
文献类型：专利
| 作者 | EPLER, JOHN E.; KRAMES, MICHAEL R.; NEFF, JAMES G.; SCHIAFFINO, STEFANO |
| 发表日期 | 2011-05-19 |
| 专利号 | US20110114987A1 |
| 著作权人 | LUMILEDS LLC |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Compliant bonding structures for semiconductor devices |
| 英文摘要 | A light emitting device includes a semiconductor structure comprising a light emitting layer disposed between an n-type region and a p-type region, a metal p-contact disposed on the p-type region, and a metal n-contact disposed on the n-type region. The metal p-contact and the metal n-contact are both formed on the same side of the semiconductor structure. The light emitting device is connected to a mount by a bonding structure. The bonding structure includes a plurality of metal regions separated by gaps and a metal structure disposed between the light emitting device and the mount proximate to an edge of the light emitting device. The metal structure is configured such that during bonding, the metal structure forms a continuous seal between the light emitting device and the mount. |
| 公开日期 | 2011-05-19 |
| 申请日期 | 2010-10-05 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54182]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | LUMILEDS LLC |
| 推荐引用方式 GB/T 7714 | EPLER, JOHN E.,KRAMES, MICHAEL R.,NEFF, JAMES G.,et al. Compliant bonding structures for semiconductor devices. US20110114987A1. 2011-05-19. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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