Semiconductor laser chip, semiconductor laser device, and semiconductor laser chip manufacturing method
文献类型：专利
| 作者 | KAWAKAMI, TOSHIYUKI; ARIYOSHI, AKIRA |
| 发表日期 | 2011-06-09 |
| 专利号 | US20110134948A1 |
| 著作权人 | SHARP KABUSHIKI KAISHA |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Semiconductor laser chip, semiconductor laser device, and semiconductor laser chip manufacturing method |
| 英文摘要 | Provided is a semiconductor laser chip improved more in heat dissipation performance. This semiconductor laser chip includes a substrate, which has a front surface and a rear surface, nitride semiconductor layers, which are formed on the front surface of the substrate, an optical waveguide (ridge portion), which is formed in the nitride semiconductor layers, an n-side electrode, which is formed on the rear surface of the substrate, and notched portions, which are formed in regions that include the substrate to run along the optical waveguide (ridge portion). The notched portions have notched surfaces on which a metal layer connected to the n-side electrode is formed. |
| 公开日期 | 2011-06-09 |
| 申请日期 | 2010-12-02 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54201]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SHARP KABUSHIKI KAISHA |
| 推荐引用方式 GB/T 7714 | KAWAKAMI, TOSHIYUKI,ARIYOSHI, AKIRA. Semiconductor laser chip, semiconductor laser device, and semiconductor laser chip manufacturing method. US20110134948A1. 2011-06-09. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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