Flexible optoelectronic interconnection module and method of manufacturing the same
文献类型：专利
| 作者 | UEMURA, HIROSHI; FURUYAMA, HIDETO |
| 发表日期 | 2011-08-04 |
| 专利号 | US20110188816A1 |
| 著作权人 | KABUSHIKI KAISHA TOSHIBA |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Flexible optoelectronic interconnection module and method of manufacturing the same |
| 英文摘要 | According to one embodiment, a flexible optoelectronic interconnection module according to one embodiment includes a flexible electrical wiring board including an electrical wire and first electrical connection terminal, and a flexible optoelectronic interconnection board including an optical interconnection path, electrical wire, and second electrical connection terminal and mounted on a partial region of the flexible electrical wiring board. On the flexible optoelectronic interconnection board, an optical semiconductor element electrically connected to the electrical wire of the interconnection board and optically coupled with the optical interconnection path is mounted. The first and second electrical connection terminals are electrically connected by a conductive connecting member. |
| 公开日期 | 2011-08-04 |
| 申请日期 | 2011-01-20 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54213]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | KABUSHIKI KAISHA TOSHIBA |
| 推荐引用方式 GB/T 7714 | UEMURA, HIROSHI,FURUYAMA, HIDETO. Flexible optoelectronic interconnection module and method of manufacturing the same. US20110188816A1. 2011-08-04. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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