Semiconductor apparatus with thin semiconductor film
文献类型：专利
| 作者 | OGIHARA, MITSUHIKO; FUJIWARA, HIROYUKI; SAKUTA, MASAAKI; ABIKO, ICHIMATSU |
| 发表日期 | 2011-06-23 |
| 专利号 | US20110147760A1 |
| 著作权人 | OKI DATA CORPORATION |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Semiconductor apparatus with thin semiconductor film |
| 英文摘要 | A semiconductor apparatus includes a substrate having at least one terminal, a thin semiconductor film including at least one semiconductor device, the thin semiconductor film being disposed and bonded on the substrate; and an individual interconnecting line formed as a thin conductive film extending from the semiconductor device in the thin semiconductor film to the terminal in the substrate, electrically connecting the semiconductor device to the terminal. Compared with conventional semiconductor apparatus, the invented apparatus is smaller and has a reduced material cost. |
| 公开日期 | 2011-06-23 |
| 申请日期 | 2011-02-24 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54217]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | OKI DATA CORPORATION |
| 推荐引用方式 GB/T 7714 | OGIHARA, MITSUHIKO,FUJIWARA, HIROYUKI,SAKUTA, MASAAKI,et al. Semiconductor apparatus with thin semiconductor film. US20110147760A1. 2011-06-23. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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