Conduction cooled package laser and packaging method for forming the same
文献类型：专利
| 作者 | OU, SZUTSUN SIMON; HSIAO, PO-WEN; HSIEH, CHIA-HUNG; YANG, HUI-PING; HSU, YING-FENG |
| 发表日期 | 2012-04-05 |
| 专利号 | US20120082176A1 |
| 著作权人 | ARIMA LASERS CORP. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Conduction cooled package laser and packaging method for forming the same |
| 英文摘要 | A packaging method for forming a conduction cooled package (CCP) laser is provided and includes soldering a semiconductor laser device on the first heat spreader; and then bonding the first heat spreader on the second spreader via an Al/Ni nano-laminated foil. Moreover, a CCP laser is also provided herein. |
| 公开日期 | 2012-04-05 |
| 申请日期 | 2011-03-28 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54221]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | ARIMA LASERS CORP. |
| 推荐引用方式 GB/T 7714 | OU, SZUTSUN SIMON,HSIAO, PO-WEN,HSIEH, CHIA-HUNG,et al. Conduction cooled package laser and packaging method for forming the same. US20120082176A1. 2012-04-05. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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