Lead frame for chip package, chip package, package module, and illumination apparatus including chip package module
文献类型：专利
| 作者 | LEE, YOUNG-JIN; LEE, JEONG-WOOK; MOON, KYUNG-MI; SONG, YOUNG-HEE; CHOI, III-HEUNG |
| 发表日期 | 2011-11-10 |
| 专利号 | US20110272716A1 |
| 著作权人 | SAMSUNG ELECTRONICS CO., LTD. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Lead frame for chip package, chip package, package module, and illumination apparatus including chip package module |
| 英文摘要 | A lead frame for a chip package, a chip package, a package module, and an illumination apparatus including the chip package module. The chip package includes a first coupling portion and a second coupling portion that are coupled to each other on edges of a lead frame for mounting a chip thereon, and thus a package module is easily embodied by coupling the first coupling portion and the second coupling portion to each other. |
| 公开日期 | 2011-11-10 |
| 申请日期 | 2011-05-06 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54234]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SAMSUNG ELECTRONICS CO., LTD. |
| 推荐引用方式 GB/T 7714 | LEE, YOUNG-JIN,LEE, JEONG-WOOK,MOON, KYUNG-MI,et al. Lead frame for chip package, chip package, package module, and illumination apparatus including chip package module. US20110272716A1. 2011-11-10. |
入库方式： OAI收割
来源：西安光学精密机械研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。