Submounts for Semiconductor Light Emitting Devices and Methods of Forming Packaged Light Emitting Devices Including Dispensed Encapsulants
文献类型：专利
| 作者 | ANDREWS, PETER S.; LOH, BAN P.; MEDENDORP, JR., NICHOLAS W.; KELLER, BERND P. |
| 发表日期 | 2012-03-15 |
| 专利号 | US20120061702A1 |
| 著作权人 | CREE, INC. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Submounts for Semiconductor Light Emitting Devices and Methods of Forming Packaged Light Emitting Devices Including Dispensed Encapsulants |
| 英文摘要 | A submount for mounting an LED chip includes a substrate, a die attach pad configured to receive an LED chip on an upper surface of the substrate, a first meniscus control feature on the substrate surrounding the die attach pad and defining a first encapsulant region of the upper surface of the substrate, and a second meniscus control feature on the substrate surrounding the first encapsulant region and defining a second encapsulant region of the upper surface of the substrate. The first and second meniscus control features may be substantially coplanar with the die attach pad. A packaged LED includes a submount as described above and further includes an LED chip on the die attach pad, a first encapsulant on the substrate within the first encapsulant region, and a second encapsulant on the substrate within the second encapsulant region and covering the first encapsulant. Method embodiments are also disclosed. |
| 公开日期 | 2012-03-15 |
| 申请日期 | 2011-05-31 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54239]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | CREE, INC. |
| 推荐引用方式 GB/T 7714 | ANDREWS, PETER S.,LOH, BAN P.,MEDENDORP, JR., NICHOLAS W.,et al. Submounts for Semiconductor Light Emitting Devices and Methods of Forming Packaged Light Emitting Devices Including Dispensed Encapsulants. US20120061702A1. 2012-03-15. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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