Die-bonding material for optical semiconductor devices and optical semiconductor device using same
文献类型：专利
| 作者 | NISHIMURA, TAKASHI; WATANABE, TAKASHI |
| 发表日期 | 2013-04-17 |
| 专利号 | EP2581954A1 |
| 著作权人 | SEKISUI CHEMICAL CO., LTD. |
| 国家 | 欧洲专利局 |
| 文献子类 | 发明申请 |
| 其他题名 | Die-bonding material for optical semiconductor devices and optical semiconductor device using same |
| 英文摘要 | The present invention provides a die bonding material for an optical semiconductor device which has high thermal conductivity and can prevent cracking in an optical semiconductor device including the die bonding material. The die bonding material for an optical semiconductor device includes: a first silicone resin containing a hydrogen atom bonded to a silicon atom, a second silicone resin not containing a hydrogen atom bonded to a silicon atom, but containing an alkenyl group, a catalyst for hydrosilylation reaction, and at least one substance selected from the group consisting of anhydrous magnesium carbonate represented by chemical formula MgCO3 not containing crystal water and coated bodies including the anhydrous magnesium carbonate and an organic resin, a silicone resin, or silica coated on the surface thereof. |
| 公开日期 | 2013-04-17 |
| 申请日期 | 2011-06-07 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54241]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SEKISUI CHEMICAL CO., LTD. |
| 推荐引用方式 GB/T 7714 | NISHIMURA, TAKASHI,WATANABE, TAKASHI. Die-bonding material for optical semiconductor devices and optical semiconductor device using same. EP2581954A1. 2013-04-17. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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