Light emitting device package and method of manufacturing the same
文献类型：专利
| 作者 | CHAN, SHIUN-WEI; KE, CHIH-HSUN |
| 发表日期 | 2012-03-29 |
| 专利号 | US20120074452A1 |
| 著作权人 | ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Light emitting device package and method of manufacturing the same |
| 英文摘要 | A light emitting device package includes a base, a light emitting element, a mask, metal wires, an encapsulating layer and a cover layer. The base has a first surface bearing electrical structure thereon and an opposite second surface. The mask is arranged on the first surface to define a space receiving the light emitting element. Two openings are defined in the mask. The light emitting element has two pads exposed to an outside through the two openings respectively. The metal wires electrically connect the pads and the electrical structures. The encapsulating layer is filled in the space and two through holes in the base and encapsulates the light emitting element. The encapsulating layer is separated from the metal wires. The cover layer covers and protects the mask and the metal wires. A method of manufacturing the package is also provided. |
| 公开日期 | 2012-03-29 |
| 申请日期 | 2011-06-29 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54247]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. |
| 推荐引用方式 GB/T 7714 | CHAN, SHIUN-WEI,KE, CHIH-HSUN. Light emitting device package and method of manufacturing the same. US20120074452A1. 2012-03-29. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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