High thermal conductivity and low degradation die attach with dual adhesive
文献类型：专利
| 作者 | NG, KEAT CHUAN; CHAN, BIT TIE; TAN, KHENG LENG |
| 发表日期 | 2013-03-14 |
| 专利号 | US20130062655A1 |
| 著作权人 | AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | High thermal conductivity and low degradation die attach with dual adhesive |
| 英文摘要 | A package for a light source, a semiconductor device, and methods of manufacturing the same are disclosed. In particular, a Light Emitting Diode (LED) dice is attached to a bonding pad of the light source package by two discrete types of different adhesives. One of the adhesives may be curable under exposure to Ultraviolet (UV) light and the other adhesive may be cured under thermal radiation, but is stable when exposed to UV light. |
| 公开日期 | 2013-03-14 |
| 申请日期 | 2011-09-09 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54265]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED |
| 推荐引用方式 GB/T 7714 | NG, KEAT CHUAN,CHAN, BIT TIE,TAN, KHENG LENG. High thermal conductivity and low degradation die attach with dual adhesive. US20130062655A1. 2013-03-14. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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