Light emitting device package and method of manufacturing thereof
文献类型：专利
| 作者 | YOO, CHEOL JUN; SONG, YOUNG HEE; HWANG, SEONG DEOK; LEE, SANG HYUN |
| 发表日期 | 2012-08-16 |
| 专利号 | US20120205696A1 |
| 著作权人 | SAMSUNG ELECTRONICS CO., LTD. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Light emitting device package and method of manufacturing thereof |
| 英文摘要 | There are provided a light emitting device package and a method of manufacturing thereof. The light emitting device package including a first lead frame including amounting area and a heat radiating area surrounding the mounting area, the mounting area being protruded upwardly so as to be located higher than the heat radiating area; a second lead frame disposed to be spaced apart from the first lead frame; at least one light emitting device disposed on the mounting area of the first lead frame; a molding part formed so as to fix the first and second lead frame leads thereto; and a lens part disposed over the at least one light emitting device and the molding part, and the method of manufacturing the light emitting device package are provided. |
| 公开日期 | 2012-08-16 |
| 申请日期 | 2012-01-23 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54297]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SAMSUNG ELECTRONICS CO., LTD. |
| 推荐引用方式 GB/T 7714 | YOO, CHEOL JUN,SONG, YOUNG HEE,HWANG, SEONG DEOK,et al. Light emitting device package and method of manufacturing thereof. US20120205696A1. 2012-08-16. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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