Method for Producing a Light-Emitting Semiconductor Component and Light-Emitting Semiconductor Component
文献类型：专利
| 作者 | ENGL, KARL; BAISL, RICHARD; SCHLENKER, TILMAN; HOEPPEL, LUTZ; TAEGER, SEBASTIAN; GAERTNER, CHRISTIAN |
| 发表日期 | 2013-11-28 |
| 专利号 | US20130313604A1 |
| 著作权人 | OSRAM OPTO SEMICONDUCTORS GMBH |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Method for Producing a Light-Emitting Semiconductor Component and Light-Emitting Semiconductor Component |
| 英文摘要 | A method for producing a light-emitting semiconductor component is specified. A light-emitting semiconductor chip is arranged on a mounting area of a carrier. The semiconductor chip is electrically connected to electrical contact regions on the mounting area. An encapsulation layer is applied to the semiconductor chip by means of atomic layer deposition. All surfaces of the semiconductor chip which are free after mounting and electrical connection are covered with an encapsulation layer. Furthermore, a light-emitting semiconductor component is specified. |
| 公开日期 | 2013-11-28 |
| 申请日期 | 2012-04-11 |
| 状态 | 申请中 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54316]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | OSRAM OPTO SEMICONDUCTORS GMBH |
| 推荐引用方式 GB/T 7714 | ENGL, KARL,BAISL, RICHARD,SCHLENKER, TILMAN,et al. Method for Producing a Light-Emitting Semiconductor Component and Light-Emitting Semiconductor Component. US20130313604A1. 2013-11-28. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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