Method of bonding a semiconductor device using a compliant bonding structure
文献类型：专利
| 作者 | NEFF, JAMES G.; EPLER, JOHN E.; SCHIAFFINO, STEFANO |
| 发表日期 | 2012-09-06 |
| 专利号 | US20120225505A1 |
| 著作权人 | LUMILEDS LLC |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Method of bonding a semiconductor device using a compliant bonding structure |
| 英文摘要 | A compliant bonding structure is disposed between a semiconductor device and a mount. In some embodiments, the device is a light emitting device. When the semiconductor light emitting device is attached to the mount, for example by providing ultrasonic energy to the semiconductor light emitting device, the compliant bonding structure collapses to partially fill a space between the semiconductor light emitting device and the mount. In some embodiments, the compliant bonding structure is plurality of metal bumps that undergo plastic deformation during bonding. In some embodiments, the compliant bonding structure is a porous metal layer. |
| 公开日期 | 2012-09-06 |
| 申请日期 | 2012-05-14 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54328]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | LUMILEDS LLC |
| 推荐引用方式 GB/T 7714 | NEFF, JAMES G.,EPLER, JOHN E.,SCHIAFFINO, STEFANO. Method of bonding a semiconductor device using a compliant bonding structure. US20120225505A1. 2012-09-06. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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