中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Microchip and SOI substrate for manufacturing microchip

文献类型:专利

作者AKIYAMA, SHOJI; KUBOTA, YOSHIHIRO; ITO, ATSUO; TANAKA, KOICHI; KAWAI, MAKOTO; TOBISAKA, YUUJI
发表日期2012-09-13
专利号US20120228730A1
著作权人SHIN-ETSU CHEMICAL CO., LTD.
国家美国
文献子类发明申请
其他题名Microchip and SOI substrate for manufacturing microchip
英文摘要A plasma treatment or an ozone treatment is applied to the respective bonding surfaces of the single-crystal Si substrate in which the ion-implanted layer has been formed and the quartz substrate, and the substrates are bonded together. Then, a force of impact is applied to the bonded substrate to peel off a silicon thin film from the bulk portion of single-crystal silicon along the hydrogen ion-implanted layer, thereby obtaining an SOI substrate having an SOI layer on the quartz substrate. A concave portion, such as a hole or a micro-flow passage, is formed on a surface of the quartz substrate of the SOI substrate thus obtained, so that processes required for a DNA chip or a microfluidic chip are applied. A silicon semiconductor element for the analysis/evaluation of a sample attached/held to this concave portion is formed in the SOI layer.
公开日期2012-09-13
申请日期2012-05-21
状态失效
源URL[http://ir.opt.ac.cn/handle/181661/54335]  
专题半导体激光器专利数据库
作者单位SHIN-ETSU CHEMICAL CO., LTD.
推荐引用方式
GB/T 7714
AKIYAMA, SHOJI,KUBOTA, YOSHIHIRO,ITO, ATSUO,et al. Microchip and SOI substrate for manufacturing microchip. US20120228730A1. 2012-09-13.

入库方式: OAI收割

来源:西安光学精密机械研究所

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