Sealing agent for optical semiconductor devices, and optical semiconductor device
文献类型：专利
| 作者 | YAMAZAKI, RYOSUKE; TANIKAWA, MITSURU; WATANABE, TAKASHI; INUI, OSAMU; KUNIHIRO, YOSHITAKA; KIMU, CHIZURU; KOBAYASHI, YUSUKE; YASUI, HIDEFUMI; SUEZAKI, MINORU; KUSAKA, YASUNARI |
| 发表日期 | 2014-05-21 |
| 专利号 | EP2733178A1 |
| 著作权人 | SEKISUI CHEMICAL CO., LTD. |
| 国家 | 欧洲专利局 |
| 文献子类 | 发明申请 |
| 其他题名 | Sealing agent for optical semiconductor devices, and optical semiconductor device |
| 英文摘要 | The present invention provides an encapsulant for optical semiconductor devices, which is capable of suppressing surface tackiness of a cured product and is also capable of enhancing the heat resistance and thermal cycle characteristics of the cured product. An encapsulant for optical semiconductor devices according to the present invention which includes: a first organopolysiloxane which is represented by formula (1A) or formula (1B) and has an alkenyl group and a methyl group bonded to a silicon atom; a second organopolysiloxane which is represented by formula (51A) or formula (51B) and has a hydrogen atom bonded to a silicon atom and a methyl group bonded to a silicon atom; and a catalyst for hydrosilylation reaction, and the content ratios of methyl groups bonded to silicon atoms in the first and second organopolysiloxanes each are 80 mol% or more. (R1R2R3SiO1/2)a(R4R5SiO2/2)b(R6SiO3/2)c Formula (1A) (R1R2R3SiO1/2)a(R4R5SiO1/2)b(R6SiO3/2)c Formula (1B) (R51R52R53SiO1/2)p(R54R55SiO2/2)q(R56SiO3/2)r Formula (51A) (R51R52R53SiO1/2)p(R54R55SiO2/2)q(R56SiO3/2)r Formula (51B) |
| 公开日期 | 2014-05-21 |
| 申请日期 | 2012-07-11 |
| 状态 | 申请中 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54352]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SEKISUI CHEMICAL CO., LTD. |
| 推荐引用方式 GB/T 7714 | YAMAZAKI, RYOSUKE,TANIKAWA, MITSURU,WATANABE, TAKASHI,et al. Sealing agent for optical semiconductor devices, and optical semiconductor device. EP2733178A1. 2014-05-21. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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